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Описание 35310100 BOP 10.1 S, BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
enclosure-accessories The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.Основные характеристики 35310100 BOP 10.1 S, BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
Технические параметры
For Use With
BoPad 10.1 Enclosures
Series
BoLink
Type
Seal
Отзывы о 35310100 BOP 10.1 S, BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
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35310100 BOP 10.1 S, BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
Код: 8034099638
$89.51 Без налога: $89.51